Mise à jour le 03/11/2021
Anisotropic Conductive Film (ACF) optimized for the embedding of functional modules such as dual interfaces and fingerprint sensors in contact/contactless smart cards
- Référence produitCu-core ACF for module- and fingerprint sensor embedding
- Fabriqué parDexerials
Performs mounting functional modules by adhesion and forming electrical conduction (electric circuits) simultaneously on substrates with low heat-resistance such as PVC, PC, and PET-G.
Using ACFs as module-embedding materials instead of solder or Ag paste reduces the number of processes and improves production efficiency.
Modules can be embedded on dual interface cards and smart cards with fingerprint identification by using typical equipment (milling and embedding apparatuses) commonly used in smart card assembly processes.